Xinping Qu

Based at Fudan University, Xinping Qu focuses their scholarly efforts on Semiconductor materials, Copper interconnects, Chemical mechanical polishing, TSV metallization, Device reliability, Interface engineering, Wet etching, Passivation layers, bridging the gap between theory and practice in Semiconductor materials. A representative example of their recent contribution is the study titled "Polydopamine-coated cerium oxide core–shell nanoparticles for efficient and non-damaging chemical–mechanical polishing", which offers critical insights into the dynamics of Semiconductor materials and Copper interconnects. Additional work such as "Low contact resistance copper-copper bonding with selective electroless plating cobalt interlayer" further demonstrates their commitment to advancing knowledge in this domain.